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SMT models and SMT environment requirements - ZhiChen Electronics (ShenZhen) Co., Ltd.

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    SMT models and SMT environment requirements

    2023-07-19

    Surface mounting process:


    Includes five points: 1> Component installation type; 2> Process flow; 3> Welding process; 4>CB production process; 5> Cleaning process of the mounting plate.


    Surface mount type:


    1> Surface mounted components only;


    2> Surface mounted components and traditional plug-in components mixed board (3 kinds);


    (1) A side insertion and surface installation mix; B surface mounting.


    ② A side only insert components; B side insertion and surface mounting.


    ③ Both sides of A and B are mixed with insert and surface mounting.


    3> A side only insert, B side insert and surface mounting


    Note: Generally, there are the first and third kinds


    Surface mounting equipment (mounter) :


    Speed mode to center mode


    1> Low speed (slow) more than 1 second/point 1> mechanical alignment chip±0.1mm


    2> middle speed 0.2-1 seconds/point 2> Laser alignment chip±0.1mm


    3> High-speed (fast) less than 0.2 seconds/point 3> Visual alignment chip±0.1mm


    Mechanical alignment is contact alignment, visual alignment is non-contact alignment function: two:


    1> Single function (high-speed machine); Only the patch components between (0402-1206) can be mounted.


    2> One more function (medium speed machine); Common models are (CP33C) any kind of patch can be affixed.


    SMT environment requirements:


    ① Temperature: 25±3℃; The room temperature is in the range of 10℃ ~ 30℃;


    ② Humidity: 65±10%; Places with non-condensing humidity in the range of 20% to 90%;


    3 Dust-free and smoke-free places; No severe vibration site;


    ④ Good grounding; No flammable and corrosive gases around; Power supply voltage fluctuation must be within ±5%;


    ⑤ have a place strong enough to support the mass of the machine;